The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2016

Filed:

Jul. 11, 2011
Applicants:

Jun Xiang, Shenzhen, CN;

Xiao-xiang Zhou, Shenzhen, CN;

Kuei-feng Chiang, Shenzhen, CN;

Inventors:

Jun Xiang, Shenzhen, CN;

Xiao-Xiang Zhou, Shenzhen, CN;

Kuei-Feng Chiang, Shenzhen, CN;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28D 15/00 (2006.01); H05K 7/20 (2006.01); H01L 23/427 (2006.01); F28D 15/02 (2006.01); F28D 15/04 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20336 (2013.01); F28D 15/0266 (2013.01); F28D 15/0275 (2013.01); F28D 15/046 (2013.01); H01L 23/427 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A loop heat pipe structure includes a transport pipe, an evaporator, a first wick layer, a second wick layer, and a plurality of grooves. The transport pipe communicates with the evaporator. The evaporator has a bottom and internally defines a first chamber and a second chamber, and has a working fluid filled therein. The first wick layer is located on the bottom, and the second wick layer is located on and covers the first wick layer. The grooves can be selectively provided on the first wick layer or the bottom. The first and second wick layers are so designed that the situation of very high vapor pressure would not occur in the second chamber, enabling the loop heat pipe structure to have upgraded heat dissipation efficiency.


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