The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2016

Filed:

Aug. 08, 2013
Applicant:

A. Raymond ET Cie., Grenoble, FR;

Inventors:

Ida Tem Mai-Krist, White Lake, MI (US);

Jeffrey Hugh Moser, White Lake, MI (US);

Peter Ziereisen, Rochester Hills, MI (US);

Assignee:

A. Raymond Et Cie, Grenoble, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 33/00 (2006.01); H05K 5/02 (2006.01); H01R 12/70 (2011.01); H05B 3/08 (2006.01); H01R 4/00 (2006.01); H01R 4/02 (2006.01); H01R 12/57 (2011.01);
U.S. Cl.
CPC ...
H05K 5/0247 (2013.01); H01R 4/00 (2013.01); H01R 4/02 (2013.01); H01R 12/57 (2013.01); H01R 12/7041 (2013.01); H05B 3/08 (2013.01); H01R 2201/02 (2013.01); H01R 2201/26 (2013.01);
Abstract

A connector for attachment to glass for connecting an electrically conductive substrate to an electric conduit is disclosed. The connector includes an electrically non-conductive housing having an interior region and an underside with a slot formed therein. The connector further includes an electrically conductive insert. The conductive insert has a contact portion that extends at least partially through the slot defined in the housing. A pre-applied, heat-activatable adhesive is provided on the underside of the housing for attaching the housing to the glass. The disclosed invention is provided in two embodiments, one that maintains conductivity between the substrate and the contact portion by a compressive force and one that maintains conductivity by lead-free solder. In the first embodiment, the contact portion includes a conductive skid extending therefrom. In the second embodiment, at least the contact portion of the conductive insert is coated with lead-free solder.


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