The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2016
Filed:
May. 18, 2012
Applicant:
James L. Say, Breckenridge, CO (US);
Inventor:
James L. Say, Breckenridge, CO (US);
Assignee:
PEPEX BIOMEDICAL, INC., St. Louis, MO (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 21/306 (2006.01); G01N 27/327 (2006.01); H01L 21/683 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/00 (2013.01); G01N 27/3272 (2013.01); H01L 21/306 (2013.01); H01L 21/78 (2013.01); H01L 24/82 (2013.01); B81C 1/00317 (2013.01); B81C 1/00333 (2013.01); B81C 1/00888 (2013.01); H01L 21/6836 (2013.01); Y10T 29/49155 (2015.01);
Abstract
Certain processes for manufacturing an electrochemical sensor module include etching a Silicon wafer to form precursor sensor bodies, disposing sensor fibers along rows of the precursor sensor bodies, securing a rigid layer over the sensor fibers, dividing the wafer, rigid layer, and sensor fibers into individual precursor sensor bodies, and joining each precursor sensor body to a component body to form sensor modules.