The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2016

Filed:

Nov. 11, 2013
Applicant:

Jx Nippon Mining & Metals Corporation, Tokyo, JP;

Inventors:

Hideta Arai, Hitachi, JP;

Atsushi Miki, Hitachi, JP;

Kohsuke Arai, Hitachi, JP;

Kaichiro Nakamuro, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); H05K 1/05 (2006.01); C25D 1/04 (2006.01); H05K 1/09 (2006.01); C25D 7/06 (2006.01); H05K 3/38 (2006.01); B32B 15/08 (2006.01); B32B 33/00 (2006.01); H05K 3/30 (2006.01); H05K 3/36 (2006.01); H05K 3/02 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); B32B 15/08 (2013.01); B32B 33/00 (2013.01); C25D 1/04 (2013.01); C25D 7/0614 (2013.01); H05K 1/056 (2013.01); H05K 3/30 (2013.01); H05K 3/36 (2013.01); H05K 3/382 (2013.01); B32B 2250/02 (2013.01); B32B 2255/06 (2013.01); B32B 2311/12 (2013.01); B32B 2379/08 (2013.01); B32B 2457/08 (2013.01); H05K 1/0393 (2013.01); H05K 3/022 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0317 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49126 (2015.01); Y10T 428/12431 (2015.01); Y10T 428/31681 (2015.04);
Abstract

A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided. A surface treated copper foil comprising at least one surface treated surface with a color difference ΔE*ab of 40 or more based on JIS Z 8730, and a difference between the top average Bt and the bottom average Bb in a brightness curve extending from an end of the copper foil to a portion without the copper foil ΔB (ΔB=Bt−Bb) of 40 or more, after lamination of the surface treated surface to a polyimide having a ΔB (PI) defined as above of 50 or more and 65 or less before being laminated to the copper foil, wherein the brightness curve is obtained from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the copper foil through the polyimide with a CCD camera for the respective observation spots along the direction perpendicular to the extending direction of the observed copper foil.


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