The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2016

Filed:

Nov. 18, 2014
Applicant:

Institute for Information Industry, Taipei, TW;

Inventors:

Yeh-Kuang Wu, New Taipei, TW;

Liang-Chun Chang, Taipei, TW;

Hui-Chun Wang, New Taipei, TW;

Wen-Tai Hsieh, Taipei, TW;

Hsiao-Chen Chang, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04B 1/04 (2006.01); H04W 4/00 (2009.01); H04W 52/02 (2009.01); H04B 17/27 (2015.01);
U.S. Cl.
CPC ...
H04B 1/0475 (2013.01); H04B 17/27 (2015.01); H04W 4/008 (2013.01); H04W 52/0238 (2013.01); H04B 2001/0416 (2013.01);
Abstract

A signal transmitter with adjustable signal power includes a housing, a first adjustable metal shielding layer and a circuit board. The first adjustable metal shielding layer is disposed within the housing. The area of the first adjustable metal shielding layer consists of a first shielding area and a first un-shielding area. The first shielding area and the first un-shielding area are adjustable. The circuit board is disposed within the housing, and is located below the first adjustable metal shielding layer. The circuit board is electrically connected with the first adjustable metal shielding layer, and includes a signal emission chip. The signal emission chip is configured for adjusting signal emission power to emit a signal according to the first un-shielding area of the first adjustable metal shielding layer. A message generating system and a signal power adjusting method are disclosed herein as well.


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