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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9503099 B1

PDFFull Text
Date of Patent:
Nov. 22, 2016

Filed:

Nov. 17, 2015

Temperature compensated crystal oscillator

Applicant:

Kyocera Crystal Device Corporation, Higashine-shi, Yamagata, JP;

Inventors:

Yoshiaki Yokoo, Higashine, JP;

Harushi Kenjo, Higashine, JP;

Shota Takai, Higashine, JP;

Assignee:

KYOCERA CRYSTAL DEVICE CORPORATION, Higashine-shi, Yamagata, JP;

Attorney:

Westerman, Hattori, Daniels & Adrian, LLP

Primary Examiner:

Levi Gannon

Int. Cl.
CPC ...
H03B 5/32 (2006.01); H01L 41/047 (2006.01); H01L 41/053 (2006.01); H01L 41/083 (2006.01); H03L 1/02 (2006.01); H03H 9/17 (2006.01); H03H 9/05 (2006.01); H01L 41/09 (2006.01); H03H 9/215 (2006.01); H03H 9/10 (2006.01); H03L 1/04 (2006.01);
U.S. Cl.
CPC ...
H03L 1/028 (2013.01); H01L 41/047 (2013.01); H01L 41/053 (2013.01); H01L 41/083 (2013.01); H01L 41/094 (2013.01); H01L 41/0913 (2013.01); H03B 5/32 (2013.01); H03H 9/0552 (2013.01); H03H 9/0557 (2013.01); H03H 9/0561 (2013.01); H03H 9/1021 (2013.01); H03H 9/17 (2013.01); H03H 9/176 (2013.01); H03H 9/215 (2013.01); H03L 1/04 (2013.01);
Abstract

The temperature compensated crystal oscillator has a rectangular substrate, a frame which is provided on an upper surface of the substrate, a mounting frame which has joining pads which are provided along an outer circumferential edge of the upper surface and which is provided on a lower surface of the substrate by bonding of joining terminals which are provided along the outer circumferential edge of the lower surface of the substrate and the joining pads, a crystal element which is mounted on an electrode pad which is provided on the upper surface of the substrate in a region surrounded by the frame, an integrated circuit element which has a temperature sensor and which is mounted on a connection pad which is provided on the lower surface of the substrate in a region surrounded by the mounting frame, and a lid which is joined to the upper surface of the frame.

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