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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9503018 B1

PDFFull Text
Date of Patent:
Nov. 22, 2016

Filed:

Nov. 17, 2015

Semiconductor device

Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Toshiaki Tsutsumi, Kanagawa, JP;

Yoshihiro Funato, Kanagawa, JP;

Tomonori Okudaira, Kanagawa, JP;

Tadato Yamagata, Kanagawa, JP;

Akihisa Uchida, Kanagawa, JP;

Takeshi Terasaki, Hitachinaka, JP;

Tomohisa Suzuki, Kasama, JP;

Yoshiharu Kanegae, Hitachinaka, JP;

Assignee:

RENESAS ELECTRONICS CORPORATION, Tokyo, JP;

Attorney:

Shapiro, Gabor and Rosenberger, PLLC

Primary Examiner:

Jeffrey Shin

Int. Cl.
CPC ...
H03B 5/24 (2006.01); H01L 23/31 (2006.01); H01L 23/522 (2006.01); H01L 27/06 (2006.01); H03L 7/24 (2006.01); H01L 49/02 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H03B 5/24 (2013.01); H01L 23/3107 (2013.01); H01L 23/5228 (2013.01); H01L 24/06 (2013.01); H01L 27/0629 (2013.01); H01L 28/20 (2013.01); H01L 28/24 (2013.01); H03L 7/24 (2013.01); H01L 24/05 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/06179 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01);
Abstract

A semiconductor device is formed by sealing, with a resin, a semiconductor chip (CP) having an oscillation circuit utilizing a reference resistor. The oscillation circuit generates a reference current by utilizing the reference resistor, a voltage is generated in accordance with this reference current and an oscillation frequency of the oscillation unit, and the oscillation unit oscillates at a frequency in accordance with the generated voltage. The reference resistor is formed of a plurality of resistors, which extend in a first (Y) direction orthogonal to a first side, inside a first region (RG, RG, RG, and RG) surrounded by the first side (S, S, S, and S) of a main surface of the semiconductor chip (CP), a first line (, and) connecting between one end of the first side and the center (CT) of the main surface of the semiconductor chip, and a second line (, and) connecting between the other end of the first side and the center of the main surface of the semiconductor chip.

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