The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2016
Filed:
Sep. 23, 2015
Applicant:
Seagate Technology Llc, Cupertino, CA (US);
Inventors:
Roger L. Hipwell, Jr., Eden Prairie, MN (US);
Dadi Setiadi, Edina, MN (US);
Assignee:
SEAGATE TECHNOLOGY LLC, Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/022 (2006.01); H01L 21/78 (2006.01); H01L 21/683 (2006.01); H01S 5/02 (2006.01); G11B 5/105 (2006.01); G11B 5/31 (2006.01); G11B 5/00 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02268 (2013.01); G11B 5/105 (2013.01); G11B 5/3173 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01S 5/0201 (2013.01); H01S 5/0226 (2013.01); H01S 5/02236 (2013.01); H01S 5/02272 (2013.01); G11B 2005/0021 (2013.01); H01S 5/02252 (2013.01);
Abstract
A wafer is formed having a plurality of laser-to-slider submount features on a first surface. An etching process is used to form scribe lines between the submounts on the first surface of the wafer. The wafer is separated at the scribe lines to form the submounts.