The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2016

Filed:

Jan. 12, 2016
Applicant:

Dai-ichi Seiko Co., Ltd., Kyoto-shi, JP;

Inventor:

Yoichi Hashimoto, Tokyo, JP;

Assignee:

DAI-ICHI SEIKO CO., LTD., Kyoto-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H01R 24/44 (2011.01); H01R 101/00 (2006.01);
U.S. Cl.
CPC ...
H01R 24/44 (2013.01); H01R 2101/00 (2013.01);
Abstract

Good signal transmission characteristics can be stably obtained by a simple configuration. A void portion formed by inner wall surfaces of a groove disposed so as to face a wire connection part of a cable-shaped signal transmission medium and an inner conductor contact is provided in part of an insulative pressing plate, which is opened/closed integrally with a shell cover portion, and the wire connection part thereof and the void portion are disposed in a radial-direction inner region of a shield shell. As a result, an air layer for impedance adjustment formed by the void portion of the insulative pressing plate is disposed so as to face the wire connection part, at which mismatching of impedance easily occurs, and the matching degree (VSWR) of impedance can be efficiently adjusted.


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