The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2016

Filed:

Jan. 10, 2014
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Reinhold Melcher, Erlangen, DE;

Michael Guenther, Stuttgart, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/047 (2006.01); H01L 41/293 (2013.01); H01L 41/113 (2006.01); H01L 41/313 (2013.01);
U.S. Cl.
CPC ...
H01L 41/0477 (2013.01); H01L 41/0472 (2013.01); H01L 41/0475 (2013.01); H01L 41/1132 (2013.01); H01L 41/293 (2013.01); H01L 41/313 (2013.01); Y10T 29/42 (2015.01);
Abstract

An electrically conductive contact layer () is provided with a joining material () during a method for producing a piezoelectric component (), in particular a piezoelectric sensor (). To this end, the electrically conductive contact layer () can be dipped into a paste that serves to form the joining material (). The contact layer () provided with the joining material () is subsequently disposed between a first piezoceramic layer () and a second piezoceramic layer (). The contact layer () is then inserted via the joining material () between the first piezoceramic layer () and the second piezoceramic layer (), wherein a pressure is applied to the first piezocermaic layer () against the second piezoceramic layer ().


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