The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2016

Filed:

Nov. 06, 2013
Applicant:

Starlite Led Inc., Fremont, CA (US);

Inventors:

Pao Chen, Milpitas, CA (US);

Chung Chi Chang, San Jose, CA (US);

Ming Chieh Huang, Fremont, CA (US);

Assignee:

STARLITE LED INC., Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); H01L 33/48 (2010.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 33/64 (2013.01); H01L 33/0095 (2013.01); H01L 33/48 (2013.01); H01L 33/486 (2013.01); H01L 33/641 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0075 (2013.01);
Abstract

A method is provided for manufacturing a LED package base including providing a metal core substrate having a top surface and a bottom surface and forming two first trenches in the metal core substrate. The first trenches extend from the top surface to the bottom surface. The method further includes at least partially filling in the first trenches with first dielectric material to form dielectric isolations. The dielectric isolations divide the metal core substrate into three metal core portions. Two of the metal core portions may be configured to serve as LED package electrodes. The method also includes applying a second dielectric material to cover at least a portion of the first dielectric material, and forming a conductive layer over the second dielectric material to form circuit contacts. The conductive layer includes a first conductive material.


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