The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2016

Filed:

Jun. 28, 2013
Applicant:

Sunpower Corporation, San Jose, CA (US);

Inventors:

Thomas Pass, San Jose, CA (US);

Richard Sewell, Los Altos, CA (US);

Taeseok Kim, Pleasanton, CA (US);

Gabriel Harley, Mountain View, CA (US);

David F. J. Kavulak, Fremont, CA (US);

Xiuwen Tu, San Jose, CA (US);

Assignee:

SunPower Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/0224 (2006.01); H01L 31/04 (2014.01); H01L 31/05 (2014.01); H01L 31/068 (2012.01); H01L 31/18 (2006.01); H01L 31/048 (2014.01);
U.S. Cl.
CPC ...
H01L 31/048 (2013.01); H01L 31/0516 (2013.01); H01L 31/1876 (2013.01); Y02E 10/50 (2013.01); Y02P 70/521 (2015.11);
Abstract

An adhesive may be applied to a surface of a reusable carrier. Metal foil may be attached to the adhesive to couple the metal foil to the surface of the reusable carrier. The metal foil may be patterned without damaging the reusable carrier. A semiconductor structure (e.g., a solar cell) may be attached to the patterned metal foil. The reusable carrier may then be removed. In some embodiments, the semiconductor structure may be encapsulated using an encapsulant, with the adhesive being compatible with the encapsulant.


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