The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2016
Filed:
May. 27, 2014
Boe Technology Group Co., Ltd., Beijing, CN;
Beijing Boe Display Technology Co., Ltd., Beijing, CN;
BOE Technology Group Co., Ltd., Beijing, CN;
Beijing BOE Display Technology Co., Ltd., Beijing, CN;
Abstract
An array substrate with connecting leads and a manufacturing method thereof are provided. The array substrate includes a substrate; a plurality of signal lines formed of a metal layer, which are disconnected at a cut zone of the substrate; a plurality of connecting leads disposed in an adjacent layer of the signal lines, which correspond to locations of the signal lines where they are disconnected, and directly contact with the signal lines; wherein, two ends of each of the signal lines in its disconnected position are electrically joined by the connecting leads, and the signal lines include gate lines, the connecting leads include first leads; wherein, the first leads are formed on the substrate, and the gate lines are located in an upper level than the first leads.