The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2016
Filed:
May. 08, 2013
Applicant:
Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Inventors:
Sang-eui Lee, Yongin-si, KR;
Dong-earn Kim, Seoul, KR;
Dong-ouk Kim, Pyeongtaek-si, KR;
Ha-jin Kim, Suwon-si, KR;
Sung-hoon Park, Seoul, KR;
Min-jong Bae, Yongin-si, KR;
Yoon-chul Son, Hwaseong-si, KR;
Kun-mo Chu, Seoul, KR;
In-Taek Han, Seoul, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-Si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03G 15/20 (2006.01);
U.S. Cl.
CPC ...
G03G 15/2057 (2013.01);
Abstract
A heating member for a fusing apparatus includes a resistive heating layer including a base polymer and an electroconductive filler dispersed in the base polymer, where the resistive heating layer generates heat by receiving electric energy, and where a storage modulus of the resistive heating layer is about 1.0 megapascal or greater.