The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2016

Filed:

Jun. 10, 2014
Applicant:

Samsung Display Co., Ltd., Yongin, Gyeonggi-Do, KR;

Inventors:

TaeHwan Kim, Gyeonggi-do, KR;

Myeonghee Kim, Gyeonggi-do, KR;

Youngbae Kim, Gyeonggi-do, KR;

Jong Seong Kim, Seoul, KR;

Myunghwan Park, Gyeonggi-do, KR;

Jonghwan Lee, Seoul, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Yongin, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); G02F 1/1333 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
G02F 1/133305 (2013.01); H01L 27/124 (2013.01); H01L 27/1262 (2013.01); G02F 2202/22 (2013.01); H01L 21/02038 (2013.01); H01L 21/02172 (2013.01); H01L 21/02296 (2013.01);
Abstract

The method of manufacturing a device substrate includes forming a surface modifying layer on a process substrate. The surface modifying layer has a different hydrophobicity from that of the process substrate. The process substrate is disposed on a carrier substrate. The surface modifying layer is disposed between the process substrate and the carrier substrate. A device is formed on the process substrate. The process substrate is separated from the carrier substrate.


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