The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2016

Filed:

Feb. 26, 2016
Applicant:

Oclaro Japan, Inc., Kanagawa, JP;

Inventors:

Kazuhiro Komatsu, Tokyo, JP;

Takuma Ban, Kanagawa, JP;

Fumitoshi Goto, Kanagawa, JP;

Yoichiro Igarashi, Tokyo, JP;

Assignee:

OCLARO JAPAN, INC., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); G02B 6/42 (2006.01); G02B 6/44 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4281 (2013.01); G02B 6/4284 (2013.01); G02B 6/444 (2013.01);
Abstract

A flexible wiring board includes a conductive film provided on one surface of a substrate. The conductive film includes a plurality of pad portions to which a plurality of connection electrodes are respectively bonded with solder, and a wiring portion extending in a direction crossing a row in which the plurality of pad portions are arranged. The plurality of pad portions include a terminal portion electrically connected with the wiring portion, and at least two land portions located on both sides of the terminal portion while avoiding electrical connection to the wiring portion. The solder includes land solder portions respectively overlaid on the at least two land portions and a terminal solder portion overlaid on the terminal portion. The land solder portion has a shape extending longer than the terminal solder portion along a direction in which the wiring portion extends from the connection electrode corresponding thereto.


Find Patent Forward Citations

Loading…