The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2016

Filed:

Mar. 04, 2014
Applicant:

Showa Denko Packaging Co., Ltd., Isehara-shi, Kanagawa, JP;

Inventors:

Yuuji Minamibori, Isehara, JP;

Tetsunobu Kuramoto, Isehara, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 10/02 (2006.01); B32B 15/088 (2006.01); B32B 7/12 (2006.01); H01M 2/02 (2006.01); B32B 15/085 (2006.01);
U.S. Cl.
CPC ...
B32B 15/088 (2013.01); B32B 7/12 (2013.01); B32B 15/085 (2013.01); H01M 2/026 (2013.01); H01M 2/0257 (2013.01); H01M 2/0262 (2013.01); H01M 2/0277 (2013.01); H01M 2/0285 (2013.01); H01M 2/0287 (2013.01); B32B 2250/03 (2013.01); B32B 2323/10 (2013.01); Y10T 428/1359 (2015.01); Y10T 428/24942 (2015.01); Y10T 428/31562 (2015.04); Y10T 428/31678 (2015.04); Y10T 428/31681 (2015.04);
Abstract

A molding packaging materialof this invention contains a biaxially stretched polyamide film layeras an outer layer, a thermoplastic resin layeras an inner layer, and a metal foil layerdisposed between the both layersand, in which a biaxially stretched polyamide film in which when the fracture strength of the film is defined as 'X' and the fracture strain of the film is defined as 'Y', the X/Y value is 230 MPa to 360 MPa is used as the biaxially stretched polyamide film. The molding packaging material can secure excellent moldability even when the molding packaging material is not coated with a slipperiness imparting component.


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