The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2016

Filed:

Nov. 25, 2008
Applicants:

Tomohiro Maekawa, Niihama, JP;

Koji Koyama, Niihama, JP;

Inventors:

Tomohiro Maekawa, Niihama, JP;

Koji Koyama, Niihama, JP;

Assignees:

SUMITOMO CHEMICAL COMPANY, LIMITED, Tokyo, JP;

ESCARBO SHEET CO., LTD., Mitsuke-Shi, Niigata, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/00 (2006.01); B29C 47/00 (2006.01); B29C 47/88 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01); B32B 27/32 (2006.01);
U.S. Cl.
CPC ...
B29C 47/8845 (2013.01); B29C 47/0021 (2013.01); B29C 47/886 (2013.01); B32B 27/08 (2013.01); B32B 27/302 (2013.01); B32B 27/308 (2013.01); B32B 27/325 (2013.01); B32B 27/365 (2013.01); B32B 2250/00 (2013.01); B32B 2250/24 (2013.01); B32B 2270/00 (2013.01); B32B 2274/00 (2013.01); B32B 2307/40 (2013.01); B32B 2307/734 (2013.01); B32B 2457/00 (2013.01); B32B 2509/00 (2013.01); B32B 2605/00 (2013.01); B32B 2605/003 (2013.01); B32B 2605/08 (2013.01);
Abstract

An object of the present invention is to provide an extruded resin film which thermally shrinks little and a method for producing the same. The present invention provides an extruded resin film, formed by an extrusion forming method, made of a thermoplastic resin, having a thickness of from 0.03 to 0.5 mm, wherein the extruded resin film has a shrinkage ratio in the extrusion direction, S1 (%), which satisfies the following formula (1) and has a shrinkage ratio in the cross-extrusion direction, S2 (%), of from 0 to 5% when being left at rest for 0.5 hours under a hot atmosphere at the temperature of 20° C. above heat distortion temperature (Th) of the thermoplastic resin:0.1/1≦1.7/  (1)wherein X is thickness of the extruded resin film (mm).


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