The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2016
Filed:
Mar. 11, 2013
Melody Tabada;
Kedar G. Shah, Oakland, CA (US);
Vanessa Tolosa, Oakland, CA (US);
Satinderall S. Pannu, Pleasanton, CA (US);
Angela Tooker, Dublin, CA (US);
Terri Delima, Livermore, CA (US);
Heeral Sheth, Oakland, CA (US);
Sarah Felix, Oakland, CA (US);
Phillipe J. Tabada, Roseville, CA (US);
Kedar G. Shah, Oakland, CA (US);
Vanessa Tolosa, Oakland, CA (US);
Satinderall S. Pannu, Pleasanton, CA (US);
Angela Tooker, Dublin, CA (US);
Terri Delima, Livermore, CA (US);
Heeral Sheth, Oakland, CA (US);
Sarah Felix, Oakland, CA (US);
Lawrence Livermore National Security, LLC, Livermore, CA (US);
Abstract
Thin-film multi-electrode arrays (MEA) having one or more electrically conductive beams conformally encapsulated in a seamless block of electrically insulating material, and methods of fabricating such MEAs using reproducible, microfabrication processes. One or more electrically conductive traces are formed on scaffold material that is subsequently removed to suspend the traces over a substrate by support portions of the trace beam in contact with the substrate. By encapsulating the suspended traces, either individually or together, with a single continuous layer of an electrically insulating material, a seamless block of electrically insulating material is formed that conforms to the shape of the trace beam structure, including any trace backings which provide suspension support. Electrical contacts, electrodes, or leads of the traces are exposed from the encapsulated trace beam structure by removing the substrate.