The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2016

Filed:

Jul. 03, 2014
Applicant:

Heraeus Precious Metals Gmbh & Co. KG, Hanau, DE;

Inventors:

Jami A. Hafiz, Cedar Park, TX (US);

Stefan Schibli, Frankfurt am Main, DE;

Jens Troetzschel, Ronneburg-Neuwiedermus, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61N 1/05 (2006.01); A61B 5/04 (2006.01); H01B 7/04 (2006.01); H01B 1/12 (2006.01); H01B 3/30 (2006.01); A61B 5/00 (2006.01); B21F 19/00 (2006.01); H01L 51/00 (2006.01); A61M 25/09 (2006.01);
U.S. Cl.
CPC ...
A61B 5/04 (2013.01); A61B 5/6846 (2013.01); A61B 5/6851 (2013.01); A61N 1/05 (2013.01); B21F 19/00 (2013.01); H01B 1/127 (2013.01); H01B 1/128 (2013.01); H01B 3/307 (2013.01); H01B 7/048 (2013.01); A61B 2562/125 (2013.01); A61M 2025/09108 (2013.01); C08G 2261/1424 (2013.01); C08G 2261/3223 (2013.01); C08G 2261/51 (2013.01); C08G 2261/65 (2013.01); C08G 2261/70 (2013.01); C08G 2261/79 (2013.01); C08G 2261/90 (2013.01); H01L 51/0037 (2013.01);
Abstract

One aspect relates to a method for producing a layered structure, including providing a substrate, forming a first layer onto at least part of the substrate, the first layer being a first polymer, and forming a second layer onto at least part of the first layer, the second layer being a second polymer. The substrate and the second layer are electrically conductive and the first layer is insulating or the substrate and the second layer are insulating and the first layer is electrically conductive. Forming each of the first and second layers includes forming such that each layer is no more than one tenth of the thickness of the substrate.


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