The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2016
Filed:
Sep. 06, 2010
Mikiko Hojo, Tokyo, JP;
Shinya Yoneda, Fukushima, JP;
Naonobu Yoshi, Ibaraki, JP;
Takeshi Sato, Kanagawa, JP;
Kisei Matsumoto, Kanagawa, JP;
Mikiko Hojo, Tokyo, JP;
Shinya Yoneda, Fukushima, JP;
Naonobu Yoshi, Ibaraki, JP;
Takeshi Sato, Kanagawa, JP;
Kisei Matsumoto, Kanagawa, JP;
DAI NIPPON PRINTING CO., LTD., Tokyo, JP;
Abstract
Provided is a metal microparticle dispersion including metal microparticles, a polymeric dispersant and a dispersion medium, wherein an average primary particle diameter of the metal microparticles is 0.001 to 0.5 μm; the polymeric dispersant has a polyester skeleton in at least one of a principal chain and a side chain thereof; or the polymeric dispersant has a polyether skeleton in at least one of a principal chain and a side chain thereof; and a content of the above polymeric dispersant is 0.1 to 100 parts by mass based on a content of 100 parts by mass of the metal microparticles. Further, provided is a production process for an electrically conductive substrate, and an electrically conductive substrate produced by the above production process is provided.