The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2016

Filed:

Mar. 29, 2013
Applicant:

Taiyo Ink Mfg. Co., Ltd., Hiki-gun, JP;

Inventors:

Daichi Okamoto, Higashimatsuyama, JP;

Shoji Minegishi, Iruma, JP;

Masao Arima, Kawagoe, JP;

Assignee:

TAIYO INK MFG. CO., LTD., Hiki-gun, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 15/00 (2006.01); H05K 1/03 (2006.01); B32B 27/08 (2006.01); G03F 7/027 (2006.01); B32B 27/26 (2006.01); G03F 7/095 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01); G03F 7/032 (2006.01); G03F 7/085 (2006.01);
U.S. Cl.
CPC ...
H05K 1/036 (2013.01); B32B 27/08 (2013.01); B32B 27/26 (2013.01); G03F 7/027 (2013.01); G03F 7/0955 (2013.01); H05K 3/287 (2013.01); G03F 7/032 (2013.01); G03F 7/085 (2013.01); H05K 3/285 (2013.01); H05K 3/3452 (2013.01); H05K 2201/0195 (2013.01); Y10T 156/10 (2015.01);
Abstract

A laminated structure including a base material and resin insulating layers formed on the base material. The resin insulating layers include a resin insulating layer (A) containing a curing accelerator composed of an N atom-containing basic compound such that the resin insulating layer (A) is in contact with the base material. The laminated structure includes a resin insulating layer (B) which contains a P atom-containing curing accelerator in addition to the resin insulating layer (A).


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