The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2016
Filed:
May. 16, 2013
Applicant:
Saint-gobain Glass France, Courbevoie, FR;
Inventors:
Klaus Schmalbuch, Aachen, DE;
Bernhard Reul, Herzogenrath, DE;
Lothar Lesmeister, Landgraaf, NL;
Mitja Rateiczak, Wuerselen, DE;
Assignee:
SAINT-GOBAIN GLASS FRANCE, Courbevoie, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 3/00 (2006.01); H01R 12/57 (2011.01); H01R 13/03 (2006.01); B23K 1/00 (2006.01); B23K 1/002 (2006.01); B23K 1/005 (2006.01); B23K 1/012 (2006.01); B23K 35/30 (2006.01); B23K 35/02 (2006.01); C22C 12/00 (2006.01); C22C 38/04 (2006.01); C22C 38/26 (2006.01); C22C 38/28 (2006.01); H01R 4/02 (2006.01); H01R 12/71 (2011.01); H01R 43/02 (2006.01); H05K 1/11 (2006.01); H01R 13/11 (2006.01); H01R 101/00 (2006.01);
U.S. Cl.
CPC ...
H01R 12/57 (2013.01); B23K 1/002 (2013.01); B23K 1/0004 (2013.01); B23K 1/005 (2013.01); B23K 1/0016 (2013.01); B23K 1/012 (2013.01); B23K 35/0222 (2013.01); B23K 35/0238 (2013.01); B23K 35/3006 (2013.01); C22C 12/00 (2013.01); C22C 38/04 (2013.01); C22C 38/26 (2013.01); C22C 38/28 (2013.01); H01R 4/02 (2013.01); H01R 12/718 (2013.01); H01R 13/03 (2013.01); H01R 43/02 (2013.01); H01R 43/0235 (2013.01); H05K 1/111 (2013.01); B23K 2001/12 (2013.01); B23K 2201/36 (2013.01); H01R 13/111 (2013.01); H01R 2101/00 (2013.01); H05B 2203/016 (2013.01);
Abstract
A pane with at least one electrical connection element, having: a substrate, an electrically conductive structure on a region of the substrate, a connection element that is implemented as a snap and contains at least one chromium-containing steel, and a layer of a soldering compound, which electrically connects the connection element to a subregion of the electrically conductive structure.