The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2016

Filed:

Oct. 08, 2014
Applicant:

Skorpios Technologies, Inc., Albuquerque, NM (US);

Inventors:

Stephen B. Krasulick, Albuquerque, NM (US);

John Dallesasse, Geneva, IL (US);

Amit Mizrahi, Albuquerque, NM (US);

Timothy Creazzo, Albuquerque, NM (US);

Elton Marchena, Albuquerque, NM (US);

John Y. Spann, Albuquerque, NM (US);

Assignee:

Skorpios Technologies, Inc., Albuquerque, NM (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 31/0232 (2014.01); H01S 5/022 (2006.01); H01S 5/026 (2006.01); H01S 5/30 (2006.01); H01S 5/02 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02327 (2013.01); H01S 5/026 (2013.01); H01S 5/02248 (2013.01); H01S 5/02268 (2013.01); H01S 5/02272 (2013.01); H01S 5/3013 (2013.01); H01S 5/021 (2013.01); H01S 5/02252 (2013.01);
Abstract

A method for fabricating a composite device comprises providing a platform, providing a chip, and bonding the chip to the platform. The platform has a base layer and a device layer above the base layer. An opening in the device layer exposes a portion of the base layer. The chip is bonded to the portion of the base layer exposed by the opening in the device layer. A portion of the chip extends above the platform and is removed.


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