The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2016

Filed:

Mar. 24, 2015
Applicant:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Inventors:

Davide Giuseppe Patti, Mascalucia, IT;

Gianleonardo Grasso, Giarre, IT;

Assignee:

STMICROELECTRONICS S.R.L., Agrate Brianza, IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 29/94 (2006.01); H01L 29/78 (2006.01); H01L 29/12 (2006.01); H01L 29/66 (2006.01); H01J 21/10 (2006.01); G01K 7/01 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7827 (2013.01); G01K 7/01 (2013.01); H01J 21/10 (2013.01); H01L 29/12 (2013.01); H01L 29/66969 (2013.01);
Abstract

An integrated vacuum microelectronic structure is described as having a highly doped semiconductor substrate, a first insulating layer placed above said doped semiconductor substrate, a first conductive layer placed above said first insulating layer, a second insulating layer placed above said first conductive layer, a vacuum trench formed within said first and second insulating layers and extending to the highly doped semiconductor substrate, a second conductive layer placed above said vacuum trench and acting as a cathode, a third metal layer placed under said highly doped semiconductor substrate and acting as an anode, said second conductive layer is placed adjacent to the upper edge of said vacuum trench, the first conductive layer is separated from said vacuum trench by portions of said second insulating layer and is in electrical contact with said second conductive layer.


Find Patent Forward Citations

Loading…