The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2016

Filed:

Aug. 20, 2014
Applicant:

Optiz, Inc., Palo Alto, CA (US);

Inventors:

Vage Oganesian, Sunnyvale, CA (US);

Zhenhua Lu, East Palo Alto, CA (US);

Assignee:

Optiz, Inc., Palo Alto, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/12 (2006.01); H01L 31/14 (2006.01); H01L 31/153 (2006.01); H01L 25/16 (2006.01); H04N 5/225 (2006.01); H04N 5/232 (2006.01); H04N 5/235 (2006.01); H04N 13/02 (2006.01); H01L 33/02 (2010.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H04N 5/2256 (2013.01); H04N 5/2257 (2013.01); H04N 5/2258 (2013.01); H04N 5/2355 (2013.01); H04N 5/23232 (2013.01); H04N 13/0239 (2013.01); H04N 13/0253 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18165 (2013.01);
Abstract

A camera module and method of making same, includes a substrate of conductive silicon having top and bottom surfaces, a sensor device, and an LED device. The substrate includes a first cavity formed into the bottom surface of the substrate and has an upper surface, an aperture extending from the first cavity upper surface to the top surface of the substrate, and a second cavity formed into the top surface of the substrate and having a lower surface. The sensor device includes at least one photodetector, is disposed at least partially in the first cavity, and is mounted to the first cavity upper surface. The LED device includes at least one light emitting diode, is disposed at least partially in the second cavity, and is mounted to the second cavity lower surface.


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