The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2016
Filed:
Jul. 03, 2013
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon, KR;
Inventors:
Do Jae Yoo, Suwon, KR;
Jung Ho Yoon, Anyang, KR;
Chul Gyun Park, Yongin, KR;
Myeong Woo Han, Hwaseong, KR;
Jung Aun Lee, Suwon, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/12 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/40 (2006.01); H01L 23/522 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 21/00 (2006.01); H05K 1/18 (2006.01); H01L 25/065 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 23/49827 (2013.01); H01L 23/5389 (2013.01); H01L 23/66 (2013.01); H01L 24/19 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 21/56 (2013.01); H01L 24/73 (2013.01); H01L 25/0657 (2013.01); H01L 25/16 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3011 (2013.01); H05K 1/185 (2013.01); H05K 2203/061 (2013.01);
Abstract
A semiconductor package including an antenna formed integrally therewith. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part and electrically connected to the semiconductor chip.