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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9496216 B1

PDFFull Text
Date of Patent:
Nov. 15, 2016

Filed:

Dec. 21, 2012

Semiconductor package including stacked semiconductor chips and a redistribution layer

Applicants:

Sung-hoon Chun, Hwaseong-si, KR;

Hye-jin Kim, Hwaseong-si, KR;

Sang-ho an, Suwon-si, KR;

Kyung-man Kim, Hwaseong-si, KR;

Seok-chan Lee, Hwaseong-si, KR;

Inventors:

Sung-Hoon Chun, Hwaseong-si, KR;

Hye-Jin Kim, Hwaseong-si, KR;

Sang-Ho An, Suwon-si, KR;

Kyung-Man Kim, Hwaseong-si, KR;

Seok-Chan Lee, Hwaseong-si, KR;

Assignee:

Samsung Electronics Co., Ltd., , KR;

Attorney:

Myers Bigel & Sibley, P.A.

Primary Examiner:

John C Ingham

Assistant Examiner:

Ismail Muse

Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 23/50 (2006.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01); H01L 23/522 (2006.01); H01L 49/02 (2006.01); H01L 23/00 (2006.01); H01L 23/525 (2006.01);
U.S. Cl.
CPC ...
H01L 23/50 (2013.01); H01L 23/5223 (2013.01); H01L 24/05 (2013.01); H01L 24/49 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 23/525 (2013.01); H01L 24/06 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 28/40 (2013.01); H01L 2224/02166 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/06102 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16135 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/4813 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48147 (2013.01); H01L 2224/48195 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/49109 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/49177 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15184 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19104 (2013.01); H01L 2924/19105 (2013.01);
Abstract

Semiconductor packages including stacked semiconductor chips are provided. The semiconductor packages may include first semiconductor chips and a second semiconductor chip that are stacked sequentially on a board. The semiconductor packages may also include a wiring layer on the memory chips and the wiring layer may include redistribution patterns and redistribution pads. Each of the memory chips may include a data pad. The data pads of the first semiconductor chips may be electrically connected to the board via the second semiconductor chip, some of redistribution patterns, and some of redistribution pads.

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