The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2016
Filed:
Jan. 03, 2014
Applicant:
Hamilton Sundstrand Corporation, Windsor Locks, CT (US);
Inventors:
Debabrata Pal, Hoffman Estates, IL (US);
John Horowy, Rockford, IL (US);
Assignee:
Hamilton Sundstrand Corporation, Windsor Locks, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 7/06 (2006.01); H01F 41/08 (2006.01); H01F 17/06 (2006.01); B33Y 10/00 (2015.01); H01F 27/02 (2006.01); H01F 27/22 (2006.01); H01F 41/00 (2006.01);
U.S. Cl.
CPC ...
H01F 41/08 (2013.01); B33Y 10/00 (2014.12); H01F 17/062 (2013.01); H01F 27/022 (2013.01); H01F 27/22 (2013.01); H01F 41/005 (2013.01); Y10T 29/49071 (2015.01); Y10T 29/49073 (2015.01);
Abstract
A plurality of cores are arranged in a loop between an inner wall and an outer wall. A gap filler is arranged circumferentially between each of the plurality of cores. A high thermal conductivity potting material is arranged around both the inner and outer edges of the core segments. A winding wraps around each of the plurality of core segments. The windings may be embedded within the high thermal conductivity potting material.