The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2016

Filed:

May. 29, 2013
Applicant:

Nof Corporation, Tokyo, JP;

Inventors:

Tatsuya Kozu, Tsukuba, JP;

Masaya Hikita, Tsukuba, JP;

Eui-chul Kang, Tsukuba, JP;

Assignee:

NOF CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); C09D 11/52 (2014.01); C22C 5/06 (2006.01); B82Y 30/00 (2011.01); B82Y 40/00 (2011.01); B22F 1/00 (2006.01); H01B 1/22 (2006.01); B22F 9/24 (2006.01); C09D 1/00 (2006.01); C09D 5/38 (2006.01); C09D 7/12 (2006.01); B22F 9/20 (2006.01); B22F 9/30 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); B22F 1/0022 (2013.01); B22F 9/20 (2013.01); B22F 9/24 (2013.01); B22F 9/30 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01); C09D 1/00 (2013.01); C09D 5/38 (2013.01); C09D 7/1266 (2013.01); C09D 11/52 (2013.01); H01B 1/02 (2013.01); B22F 1/0018 (2013.01); B22F 1/0059 (2013.01); C22C 5/06 (2013.01);
Abstract

Provided are silver nanoparticles having excellent dispersion stability and capable of forming on a substrate a silver element, such as a silver film or line, having excellent electrical conductivity and adhesivity through heating. A method for producing the silver nanoparticles, its dispersion liquid, and a substrate having a silver element formed thereon using the dispersion liquid are disclosed. The silver nanoparticles contain silver compound (A) of formula (1): amine compound (B) having a primary amino group; and polymer (C) obtained by polymerization of a monomer composition containing diol (meth)acrylate compound (c1) having a urethane bond of formula (2): (R: hydrogen atom or methyl group; R: —(CH2)n-; n: 1 to 4), and at least one monomer (c2) selected from (meth)acrylate monomers, acrylamide monomers, vinyl monomers, vinyl ether monomers, or monomers having an epoxy group.


Find Patent Forward Citations

Loading…