The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2016
Filed:
Aug. 07, 2012
Applicants:
Alan Green, Greenwood, SC (US);
Dennis Rene Benoit, Simpsonville, SC (US);
Inventors:
Alan Green, Greenwood, SC (US);
Dennis Rene Benoit, Simpsonville, SC (US);
Assignee:
Avery Dennison Corporation, Mentor, OH (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06K 19/077 (2006.01); B32B 37/00 (2006.01); B32B 37/02 (2006.01); B32B 38/00 (2006.01); B31D 1/02 (2006.01); B32B 38/06 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07758 (2013.01); B31D 1/021 (2013.01); B31D 1/027 (2013.01); B31D 1/028 (2013.01); B32B 37/025 (2013.01); B32B 38/0004 (2013.01); G06K 19/0775 (2013.01); G06K 19/07718 (2013.01); G06K 19/07745 (2013.01); G06K 19/07749 (2013.01); G06K 19/07779 (2013.01); G06K 19/07783 (2013.01); B32B 37/0053 (2013.01); B32B 38/06 (2013.01); B32B 38/145 (2013.01); B32B 2309/02 (2013.01); B32B 2309/105 (2013.01); B32B 2519/02 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15165 (2013.01); H05K 1/0393 (2013.01); H05K 3/0097 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49016 (2015.01); Y10T 29/49117 (2015.01); Y10T 29/53178 (2015.01); Y10T 156/1052 (2015.01); Y10T 156/1056 (2015.01); Y10T 156/1057 (2015.01); Y10T 156/1062 (2015.01); Y10T 156/1074 (2015.01); Y10T 156/1075 (2015.01); Y10T 156/1077 (2015.01); Y10T 156/1092 (2015.01); Y10T 156/1097 (2015.01);
Abstract
An RFID webstock containing a relatively high pitch-density array of semiconductive chips is provided and joined to a web bearing relatively widely spaced antennas in a continuous process. The RFID webstock is separated or cut into individual chip sections, with the spacing of the chips being increased as the RFID webstock is die cut. The individual chips on the sections are then joined to corresponding antennas to form an RFID inlay stock. This process is conducive to high speed roll-to-roll production of RFID tag and label roll stock.