The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2016

Filed:

Aug. 10, 2015
Applicant:

Photonic International Pte. Ltd., Singapore, SG;

Inventors:

Birendra Dutt, Westchester, CA (US);

Douglas B. Boyle, Palo Alto, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 12/08 (2016.01); G11C 7/10 (2006.01); G06F 15/78 (2006.01);
U.S. Cl.
CPC ...
G06F 12/0842 (2013.01); G06F 12/0817 (2013.01); G06F 15/781 (2013.01); G06F 15/7825 (2013.01); G11C 7/1072 (2013.01); G06F 2212/622 (2013.01); G06F 2212/70 (2013.01);
Abstract

A photonics-optimized multi-processor system may include a plurality of processor chips, each of the processor chips comprising at least one input/output (I/O) component. The multi-processor system may also include first and second photonic components. The at least one I/O component of at least one of the processor chips may be configured to directly drive the first photonic component and receive a signal from the second photonic component. A total latency from any one of the processor chips to data at any global memory location may not be dominated by a round trip speed-of-light propagation delay. A number of the processor chips may be at least 10,000, and the processor chips may be packaged into a total volume of no more than 8 m. A density of the processor chips may be greater than 1,000 chips per cubic meter.


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