The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2016
Filed:
Jan. 25, 2013
Applicant:
Allegro Microsystems, Llc, Worcester, MA (US);
Inventors:
Paul David, Bow, NH (US);
William P. Taylor, Amherst, NH (US);
P. Karl Scheller, Bow, NH (US);
Ravi Vig, Bow, NH (US);
Andreas P. Friedrich, Metz-Tessy, FR;
Assignee:
Allegro Microsystems, LLC, Worcester, MA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 33/00 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
G01R 33/00 (2013.01); G01R 33/0047 (2013.01); H01L 23/49562 (2013.01); H01L 23/49589 (2013.01); G01R 33/0011 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/73265 (2013.01);
Abstract
A magnetic field sensor includes a lead frame having a plurality of leads, at least two of which have a connection portion and a die attach portion. A semiconductor die is attached to the die attach portion of the at least two leads. In some embodiments, at least one passive component is attached to the die attach portion of at least two leads.