The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2016
Filed:
Sep. 22, 2014
Sekisui Chemical Co., Ltd., Osaka, JP;
Tokuyama Sekisui Co., Ltd., Osaka, JP;
Hiroshi Yamauchi, Osaka, JP;
Hiroyuki Morita, Osaka, JP;
Satoshi Haneda, Osaka, JP;
Yasuko Wada, Yamaguchi, JP;
SEKISUI CHEMICAL CO., LTD., Osaka, JP;
TOKUYAMA SEKISUI CO., LTD., Osaka, JP;
Abstract
The present invention provides a thermally expandable microcapsule that has a high expansion ratio and durability at high temperatures, and is not likely to cause discoloration and odor when used for foam molding. The thermally expandable microcapsule of the present invention includes: a shell formed from a polymer; and a volatile expansion agent as a core agent encapsulated by the shell, the shell obtained by polymerizing a monomer composition that contains a nitrile monomer and a compound having a glycidyl group in a molecule, the shell exhibiting a value y of 50% or higher and a ratio y/x of 1.1 or higher, in which x represents a gel fraction at ordinary temperature, and y represents a gel fraction upon heating at 180° C. for 30 minutes.