The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2016
Filed:
Nov. 14, 2012
Applicant:
Omron Corporation, Kyoto-Shi, Kyoto, JP;
Inventors:
Assignee:
OMRON Corporation, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01H 11/06 (2006.01); B81B 3/00 (2006.01); H04R 19/00 (2006.01); H04R 31/00 (2006.01); B81C 1/00 (2006.01); G01L 9/12 (2006.01); H04R 19/04 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0021 (2013.01); B81B 3/0056 (2013.01); B81C 1/00158 (2013.01); G01H 11/06 (2013.01); G01L 9/12 (2013.01); H04R 19/005 (2013.01); H04R 31/00 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); H04R 19/04 (2013.01);
Abstract
A capacitance type sensor has a semiconductor substrate having a vertically opened penetration hole, a movable electrode film arranged above the penetration hole such that a periphery portion opposes to a top surface of the semiconductor substrate with a gap provided, and a fixed electrode film arranged above the movable electrode film with a gap with respect to the movable electrode film. A concave portion having at least a part thereof formed by an inclined surface is provided in the top surface of the semiconductor substrate in a region of the top surface of the semiconductor substrate which overlaps the periphery portion of the movable electrode film.