The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2016

Filed:

Nov. 08, 2011
Applicants:

Ramond Miller Karam, Santa Barbara, CA (US);

Georges Roussos, San Jose, CA (US);

Mark Finkle, Goleta, CA (US);

Daniella M. Harvey, Santa Barbara, CA (US);

Pascal R. Ackermann-karam, Santa Barbara, CA (US);

Inventors:

Ramond Miller Karam, Santa Barbara, CA (US);

Georges Roussos, San Jose, CA (US);

Mark Finkle, Goleta, CA (US);

Daniella M. Harvey, Santa Barbara, CA (US);

Pascal R. Ackermann-Karam, Santa Barbara, CA (US);

Assignee:

PICOSYS INCORPORATED, Santa Barbara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23F 1/00 (2006.01); B32B 37/06 (2006.01); B23K 26/03 (2006.01); B23K 26/04 (2014.01); B23K 26/08 (2014.01); B29C 65/78 (2006.01); B29C 65/00 (2006.01); B01L 3/00 (2006.01); C03B 23/203 (2006.01); C03C 27/00 (2006.01); B23K 26/32 (2014.01); B29C 65/16 (2006.01);
U.S. Cl.
CPC ...
B32B 37/06 (2013.01); B01L 3/502707 (2013.01); B23K 26/032 (2013.01); B23K 26/046 (2013.01); B23K 26/0622 (2015.10); B23K 26/082 (2015.10); B23K 26/0853 (2013.01); B23K 26/211 (2015.10); B23K 26/244 (2015.10); B23K 26/32 (2013.01); B29C 65/1635 (2013.01); B29C 65/1654 (2013.01); B29C 65/1683 (2013.01); B29C 65/7841 (2013.01); B29C 66/1122 (2013.01); B29C 66/45 (2013.01); B29C 66/7465 (2013.01); C03B 23/203 (2013.01); C03C 27/00 (2013.01); B01L 2300/0887 (2013.01); B23K 2201/18 (2013.01); B23K 2201/40 (2013.01); B23K 2203/18 (2013.01); B23K 2203/50 (2015.10); B29C 65/1612 (2013.01); B29C 65/1638 (2013.01); B29C 65/7847 (2013.01); B29C 66/7392 (2013.01); B32B 2307/412 (2013.01); B32B 2310/0843 (2013.01); B32B 2315/08 (2013.01);
Abstract

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.


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