The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2016

Filed:

Sep. 29, 2014
Applicant:

Getac Technology Corporation, Hsinchu County, TW;

Inventor:

Po-Tsun Chao, Taipei, TW;

Assignee:

Getac Technology Corporation, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 9/06 (2006.01); B29C 45/16 (2006.01); B29C 45/14 (2006.01); H04R 1/02 (2006.01); B29L 9/00 (2006.01); B29L 31/00 (2006.01); B29L 31/34 (2006.01); H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/1671 (2013.01); B29C 45/14008 (2013.01); B29C 45/14778 (2013.01); B29C 45/14786 (2013.01); B29C 45/14795 (2013.01); B29C 45/14811 (2013.01); H04R 1/023 (2013.01); B29K 2995/0069 (2013.01); B29L 2009/00 (2013.01); B29L 2031/3406 (2013.01); B29L 2031/737 (2013.01); H04R 31/00 (2013.01); H04R 2499/11 (2013.01);
Abstract

A case having a speaker mesh module and a manufacturing method thereof are provided. The case includes a base, a speaker mesh module and a combination member. The base is formed with a filling port and an opening in which the speaker mesh module is correspondingly placed. The speaker mesh module is formed with a buckle part and a sound output part. The combination member is secured on the base through the filling port with an injection molding means and served to cover the speaker mesh module. The combination member is formed with a combining part mutually fastened with the buckle part and a penetrated hole corresponding to the sound output part. Accordingly, the speaker mesh module is able to be sealed in the opening with a means other than adhering, thereby allowing the case to be provided with a stable and excellent waterproof performance.


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