The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2016

Filed:

Feb. 29, 2008
Applicants:

Kenichi Hanazaki, Shizuoka, JP;

Satoru Yoshinaga, Susono, JP;

Nobuhiro Tsuji, Osaka, JP;

Inventors:

Kenichi Hanazaki, Shizuoka, JP;

Satoru Yoshinaga, Susono, JP;

Nobuhiro Tsuji, Osaka, JP;

Assignee:

Yazaki Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/02 (2006.01); B05B 5/12 (2006.01); B21C 23/26 (2006.01); B21C 1/00 (2006.01); B21C 37/04 (2006.01);
U.S. Cl.
CPC ...
B21C 23/26 (2013.01); B21C 1/00 (2013.01); B21C 37/042 (2013.01); Y10T 428/2964 (2015.01);
Abstract

An element wire, an electric wire including the element wire or the element wires, and a process for producing an element wire are provided, by which ductility of a core wire consisting of the element wires can be improved. The element wire is made of metal, at least one element wire being coated with an electrically insulating coating so as to constitute an electric wire. The crystal grains constituting the entire element wire are fine isometric grains. In the process for producing the element wire, an electrically conductive material is subjected to drawing so as to reduce a diameter of the material and subsequently subjected to successive bending along a longitudinal direction of the material.


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