The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

May. 29, 2012
Applicant:

Mahiro Tsujino, Higashiomi, JP;

Inventor:

Mahiro Tsujino, Higashiomi, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 5/02 (2006.01); H01L 23/057 (2006.01); G02B 6/42 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H05K 5/02 (2013.01); G02B 6/4265 (2013.01); G02B 6/4274 (2013.01); G02B 6/4279 (2013.01); G02B 6/4292 (2013.01); H01L 23/057 (2013.01); H01L 23/14 (2013.01); H01L 2224/48091 (2013.01);
Abstract

An element housing package includes a base body having a rectangular shape, having a mounting region for mounting a semiconductor element, a frame body disposed so as to surround the mounting region, a connection conductor disposed from the upper surface to a lower surface of the base body, a circuit conductor disposed on the lower surface of the base body, one end of the circuit conductor being electrically connected to the connection conductor and an other end of the circuit conductor being drawn out laterally from a first side surface of the base body, and a metal plate bonded to the lower surface of the base body, having an attachment region and a ground conductor region. The metal plate has an outer peripheral region which is drawn out laterally from the base body, from the ground conductor region to the attachment region along an outer periphery of the base body.


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