The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2016
Filed:
Jul. 07, 2011
Sang Myung Lee, Seoul, KR;
Byeong Ho Kim, Seoul, KR;
Jin Su Kim, Seoul, KR;
Myoung Hwa Nam, Seoul, KR;
Yeong Uk Seo, Seoul, KR;
Sung Woon Yoon, Seoul, KR;
Sang Myung Lee, Seoul, KR;
Byeong Ho Kim, Seoul, KR;
Jin Su Kim, Seoul, KR;
Myoung Hwa Nam, Seoul, KR;
Yeong Uk Seo, Seoul, KR;
Sung Woon Yoon, Seoul, KR;
LG INNOTEK CO., LTD., Seoul, KR;
Abstract
Provided is a method for manufacturing a printed circuit board. The method for manufacturing a printed circuit board includes preparing an insulation board, irradiating a laser onto a graytone mask to each a surface of the insulation board, thereby forming a circuit pattern groove and a via hole at the same time, and filling the circuit pattern groove and the via hole to form a buried circuit pattern and the via. Thus, the circuit pattern groove and the via hole may be formed using the graytone mask at the same time without perfolining a separate process for forming the via hole. Therefore, the manufacturing process may be simplified to reduce the manufacturing costs.