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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9491864 B1

PDFFull Text
Date of Patent:
Nov. 08, 2016

Filed:

Mar. 18, 2013

Unpacked structure for power device of radio frequency power amplification module and assembly method therefor

Applicant:

Innogration (Suzhou) Co., Ltd., Jiangsu, CN;

Inventor:

Gordon Chiang Ma, Jiangsu, CN;

Assignee:

Innogration (Suzhou) Co., Ltd., , CN;

Attorney:

RatnerPrestia

Primary Examiner:

Anthony Haughton

Assistant Examiner:

Razmeen Gafur

Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/18 (2006.01); H01L 23/552 (2006.01); H01L 23/13 (2006.01); H01L 23/36 (2006.01); H01L 23/66 (2006.01); H05K 1/02 (2006.01); H05K 3/32 (2006.01); H01L 23/473 (2006.01); H01L 23/053 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); H01L 23/13 (2013.01); H01L 23/36 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/49 (2013.01); H05K 1/021 (2013.01); H05K 3/328 (2013.01); H01L 23/053 (2013.01); H01L 23/3121 (2013.01); H01L 24/48 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30107 (2013.01); H05K 2201/10166 (2013.01); Y10T 29/49144 (2015.01);
Abstract

An unpacked structure for a power device of radio frequency power amplification module and assembly method therefor. The radio frequency power amplification module includes the power device, a heat dissipating plate and a printed circuit board, wherein the power device is embedded into the printed circuit board; the heat dissipating plate is arranged below the power device and the printed circuit board; the power device includes a carrier flange, a plurality of electronic elements and a plurality of lead wires; the electronic elements are directly welded on the carrier flange according to a design requirement; the power device and the printed circuit board are welded and fixed on the heat dissipating plate; and the electronic elements on the power device are connected with one another through the lead wires and directly connected with the printed circuit board through the lead wires.

Find Patent Forward Citations

Quick Actions:

Ma, Gordon. (2016). Unpacked structure for power device of radio frequency power amplification module and assembly method therefor (U.S. Patent No. 9491864). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9491864

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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