The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

Jul. 15, 2014
Applicant:

Toyoda Gosei Co., Ltd., Kiyosu-shi, JP;

Inventors:

Yoshinori Masatsugu, Kiyosu, JP;

Hideaki Kato, Kiyosu, JP;

Tomohiro Miwa, Kiyosu, JP;

Assignee:

TOYODA GOSEI CO., LTD., Kiyosu-Shi, Aichi-Ken, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/53 (2011.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01R 12/70 (2011.01); H01R 12/71 (2011.01); H01R 12/75 (2011.01);
U.S. Cl.
CPC ...
H05K 1/119 (2013.01); H01R 12/53 (2013.01); H01R 12/707 (2013.01); H01R 12/716 (2013.01); H01R 12/75 (2013.01); H05K 1/181 (2013.01); H05K 2201/10189 (2013.01);
Abstract

A wiring substrate includes a wiring pattern that is formed on a surface of a conductive board via an insulation layer and an extension part that is extended from the wiring pattern. The extension part is disposed in a portion located immediately below a detachable connector. The detachable connector is connected to a fixed connector mounted on the wiring substrate and connected and fixed to the wiring pattern.


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