The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

Jul. 24, 2014
Applicant:

Wintek Corporation, Taichung, TW;

Inventors:

Jung-Sung Lin, Taichung, TW;

Hsua-Yun Lee, Taichung, TW;

Pin-Hao Chi, Taichung, TW;

Chih-Yuan Lin, Taichung, TW;

Ming-Chuan Lin, Taichung, TW;

Assignee:

WINTEK CORPORATION, Taichung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H02H 9/00 (2006.01); H05K 1/02 (2006.01); H05F 3/00 (2006.01); H05F 3/02 (2006.01); H01R 13/648 (2006.01); H01R 12/71 (2011.01); H01R 12/70 (2011.01); H01R 12/77 (2011.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0259 (2013.01); H01R 13/6485 (2013.01); H05F 3/00 (2013.01); H05F 3/02 (2013.01); H01R 12/7005 (2013.01); H01R 12/714 (2013.01); H01R 12/775 (2013.01); H05K 1/111 (2013.01); H05K 1/113 (2013.01); H05K 2201/097 (2013.01); H05K 2201/09354 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/09445 (2013.01);
Abstract

A connection structure of an electronic device includes a circuit board, a plurality of conductive contact pads and a conductive pattern. The conductive contact pads and the conductive pattern are disposed on the circuit board. The conductive contact pads are electrically insulated from one another. The conductive pattern is electrically insulated from the conductive contact pads. The conductive pattern is disposed on at least three sides of the conductive contact pads so as to generate an electrostatic discharge protection effect for the conductive contact pads.


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