The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

Oct. 23, 2015
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventors:

Sang Soo Park, Suwon-Si, KR;

Byoung Hwa Lee, Suwon-Si, KR;

Young Ghyu Ahn, Suwon-Si, KR;

Heung Kil Park, Suwon-Si, KR;

Hyun Sub Oh, Suwon-Si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-Si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/224 (2006.01); H05K 1/02 (2006.01); H01G 4/12 (2006.01); H01G 4/236 (2006.01); H01G 4/30 (2006.01); H05K 1/18 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0213 (2013.01); H01G 4/12 (2013.01); H01G 4/224 (2013.01); H01G 4/236 (2013.01); H01G 4/30 (2013.01); H05K 1/0271 (2013.01); H05K 1/0306 (2013.01); H05K 1/181 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/2045 (2013.01);
Abstract

A multilayer ceramic electronic component includes: a board including first and second contact terminals disposed on one surface thereof to be spaced apart from each other and first and second external terminals disposed on the other surface thereof to be spaced apart from each other; a multilayer ceramic capacitor including first and second external electrodes including first and second connection portions disposed on opposite end surfaces of a ceramic body and first and second band portions extending from the first and second connection portions to portions of one surface of the ceramic body and connected to the first and second contact terminals, respectively; a sealing part enclosing the multilayer ceramic capacitor on the board while exposing one ends of the first and second contact terminals; and first and second connection terminals connecting the ends of the first and second contact terminals to the first and second external terminals, respectively.


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