The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

Apr. 20, 2015
Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventor:

Masafumi Umeno, Okazaki, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 5/00 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H05K 1/02 (2013.01); H05K 1/0204 (2013.01); H05K 1/11 (2013.01); H05K 1/115 (2013.01); H05K 5/0047 (2013.01); H05K 7/20 (2013.01); H05K 7/205 (2013.01); H05K 2201/10545 (2013.01);
Abstract

An electronic device includes a circuit board, first and second electronic components, a housing, and a heat conduction member. The first electronic component is mounted on a first surface of the circuit board, and the second electronic component is mounted on a second surface of the circuit board. The first electronic component and the second electronic component are arranged in an arrangement direction. The heat conduction member is disposed between the housing and a first component-opposite portion of the circuit board opposite to the first electronic component, and between the housing and a second component-opposite portion of the circuit board opposite to the second electronic component. The circuit board has a through hole in a formation area between the first electronic component and the second electronic component. The heat conduction member integrally covers each of the first component-opposite portion and the second component-opposite portion and the formation area of the circuit board.


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