The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

Nov. 11, 2014
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Casimer M. DeCusatis, Poughkeepsie, NY (US);

Rajaram B. Krishnamurthy, Wappingers Falls, NY (US);

Michael Onghena, Holly Springs, NC (US);

Anuradha Rao, Hopewell Junction, NY (US);

Assignee:

GlobalFoundries Inc., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/2575 (2013.01); H04B 10/25 (2013.01); G02B 6/00 (2006.01); H01L 21/00 (2006.01); H01L 25/00 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H04B 10/2575 (2013.01); G02B 6/00 (2013.01); H01L 21/00 (2013.01); H01L 25/00 (2013.01); H04B 10/2504 (2013.01); H01L 2924/0002 (2013.01); H05K 1/181 (2013.01); H05K 2201/10515 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49126 (2015.01);
Abstract

Fabricating preassembled optoelectronic interconnect structures is provided, which have an optical waveguide link with first and second optoelectronic circuits attached to first and second ends of the waveguide link. The optoelectronic circuits include active optical componentry which facilitates optical signal communication across the optical waveguide link. Further, first and second pluralities of electrical contacts are associated with the first and second optoelectronic circuits, respectively, to facilitate electrically, operatively connecting the interconnect structure between first and second components of an electronic assembly as, for instance, a single, field-replaceable unit. The first and second components of the electronic assembly may be, for instance, stacked electronic components of the electronic assembly, or laterally offset components of a substantially planar electronic assembly.


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