The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

Jun. 11, 2015
Applicant:

Tyco Electronics Corporation, Berwyn, PA (US);

Inventors:

Kyle Gary Annis, Hummelstown, PA (US);

Mitchell Kunane Storry, Harrisburg, PA (US);

Kevin Michael Thackston, York, PA (US);

Kenneth P. Dowhower, Harrisburg, PA (US);

Assignee:

TYCO ELECTRONICS CORPORATION, Berwyn, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/514 (2006.01); H01R 13/52 (2006.01); H01R 13/6581 (2011.01); H01R 12/79 (2011.01);
U.S. Cl.
CPC ...
H01R 13/5219 (2013.01); H01R 12/79 (2013.01); H01R 13/6581 (2013.01);
Abstract

An electrical connector includes a shell having a cavity and a wafer assembly received in the cavity. The wafer assembly includes a wafer housing holding a plurality of electrical wafers configured to be electrically mated to a mating connector. The wafer housing has a front end and the wafers extend forward from the front end being arranged parallel to each other within the cavity. Each wafer includes a first edge and a second edge with at least one trace between the first and second edges. An interfacial seal is provided along the front end. The interfacial seal is configured to seal between the electrical connector and the mating connector. The interfacial seal provides an environmental seal for the wafer assembly.


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