The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2016
Filed:
May. 02, 2013
Applicant:
Nitto Denko Corporation, Osaka, JP;
Inventor:
Shinichi Inoue, Osaka, JP;
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 4/66 (2006.01); H01M 10/04 (2006.01); H01B 13/00 (2006.01); H01M 10/052 (2010.01);
U.S. Cl.
CPC ...
H01M 4/668 (2013.01); H01B 13/0036 (2013.01); H01M 10/044 (2013.01); H01M 10/049 (2013.01); H01M 10/0418 (2013.01); H01M 10/052 (2013.01);
Abstract
A method for producing a laminated electrically conductive sheet includes the steps of preparing a support board, forming an electrically conductive layer at one side in a thickness direction of the support board, and transferring the electrically conductive layer onto at least one surface in the thickness direction of a resin-containing layer containing a resin.