The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

Nov. 10, 2015
Applicants:

Merck Patent Gmbh, Darmstadt, DE;

Promerus Llc, Brecksville, OH (US);

Inventors:

Piotr Wierzchowiec, Southampton, GB;

Tomas Backlund, Southampton, GB;

Li W. Tan, Eastleigh, GB;

Irina Afonina, Southampton, GB;

Pawel Miskiewicz, Cambridge, MA (US);

Paul C. Brookes, Acton, MA (US);

Larry F. Rhodes, Silver Lake, OH (US);

Andrew Bell, Lakewood, OH (US);

Assignees:

Merck Patent GmbH, Darmstadt, DE;

Promerus, LLC, Brecksville, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 35/24 (2006.01); H01L 51/10 (2006.01); H01L 51/00 (2006.01); C08F 232/08 (2006.01); H01L 51/05 (2006.01);
U.S. Cl.
CPC ...
H01L 51/107 (2013.01); C08F 232/08 (2013.01); H01L 51/0001 (2013.01); H01L 51/0012 (2013.01); H01L 51/0035 (2013.01); H01L 51/0094 (2013.01); H01L 51/0096 (2013.01); H01L 51/0508 (2013.01); C08G 2261/418 (2013.01); H01L 51/0034 (2013.01); H01L 51/0541 (2013.01); H01L 51/0545 (2013.01); Y02E 10/549 (2013.01); Y02P 70/521 (2015.11);
Abstract

The invention relates to organic electronic devices containing polycycloolefin planarization layers between the substrate and a functional layer such as a semiconducting layer, dielectric layer, or electrode; to the use of polycycloolefins as a planarization layer on the substrate of an organic electronic device; and to processes for preparing such polycycloolefin planarization layers and organic electronic devices.


Find Patent Forward Citations

Loading…