The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

Nov. 03, 2015
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Karl Weidner, München, DE;

Ralph Wirth, Lappersdorf, DE;

Axel Kaltenbacher, Ingolstadt, DE;

Walter Wegleiter, Nittendorf, DE;

Bernd Barchmann, Regensburg, DE;

Oliver Wutz, Regensburg, DE;

Jan Marfeld, Regensburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/18 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 31/0232 (2014.01); H01L 33/60 (2010.01); H01L 31/0203 (2014.01); H01L 33/56 (2010.01); H01L 23/31 (2006.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 33/483 (2013.01); H01L 23/3107 (2013.01); H01L 31/0203 (2013.01); H01L 31/0232 (2013.01); H01L 31/02327 (2013.01); H01L 33/486 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/54 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas, a surface at a top side of the semiconductor chip, and a surface at a bottom side of the semiconductor chip; a shaped body having a surface at a top side of the shaped body and a surface at an underside of the shaped body; at least one plated-through hole including an electrically conductive material; and an electrically conductive connection electrically conductively connected to the semiconductor chip and the plated-through hole, wherein the side areas of the optoelectronic semiconductor chip are covered by the shaped body, and the surface at the top side and/or the surface at the bottom side of the optoelectronic semiconductor chip are completely free of the shaped body.


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